rdlc data matrix

rdlc data matrix

rdlc data matrix

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As the material is heated further, the three-dimensional cross-linked structure begins to break down and individual bonds in the polymer structure open As decomposition continues, gaseous decomposition products are set free, which can be detected as a loss of mass of the sample in test This usually goes hand in hand with visible damage to the sample (delamination and/or strong discoloration) and significant changes in the mechanical properties of the laminate A dry test specimen of 2 20 mg is heated at 5 C/min to 150 C and then held at that temperature for 15 min This ensures that the sample is completely dry and establishes the base weight used to characterize the weight loss Then the sample is heated at 5 C/min up to a temperature of 800 C and the weight loss is continually recorded.

The temperature at which a 5 percent weight loss of the sample is detected is defined as the Td Although this test methodology is a good gauge of the thermal stability of laminate materials, the method and results must be evaluated carefully to ensure that correct conclusions are drawn from the results For example, the results of this test are dependent on the surface/ volume ratio of the specimen in test-specimens of the same weight, but different surface areas will show different results The sample with the large surface area loses weight at a faster rate and therefore shows a lower Td Samples with a large percentage of nondecomposing filler or reinforcement material will also behave differently as the measured weight change is based only on the resin content of the sample This again will lead to a seemingly higher measured Td, which may lead to erroneous conclusions.

Finally, the process of decomposition is as important as the determined value of Td and a comparison of the onset of weight loss may also be a valuable parameter to assess when comparing laminate materials using this methodology In general, a higher Td value is desirable for materials that are being selected for lead-free assembly processes as this indicates that the laminate withstands the higher assembly temperatures with an increased margin Figure 122 shows an example of different Td measurements for three different laminate materials It shows the typical decomposition rates for some sample materials and also highlights how the assessment of a material can change if different criteria are chosen If the IPC value of 5 percent weight loss is chosen, then M3 is superior to M1 and M2.

But if the materials engineer decides that the onset of weight loss (decomposition) is critical for the application, then M3 is the worst performing material The authors recommend using materials with a high onset temperature as well as a high 5 percent decomposition temperature..

Size and pitch of components are smaller while the number of I/Os is increasing. Smaller geometries allow faster transmission of signals and reduce signal crossing delay.

At the same time, enhanced performance is required for faster signal rise times, reduced parasitics, reduction of radio frequency interference (RFI) and electromagnetic interference (EMI), fewer layers, and improved high-temperature performance and reliability. HDI provides all of these advantages and more. 22.2.3 HDI Traditional PCB Comparison The interactions among printed circuit boards, components, and assemblies are best seen by the packaging technology map (see Chap. 2; Fig. 2.2). Components are characterized by the average I/Os per part, assemblies by the components per sq. cm and I/Os per sq. cm, and the printed circuit by its wiring density in cm per sq. cm. Fig. 22.1 shows the approximate crossover between the traditional printed circuit board and the next generation with microvias.4

FIGURE 22.1 The through-hole density barrier. If the ends of an electrical net contain an SMT pad connected by a trace and a via hole, then there is only so many such connections (using conventional design rules spacing) that can be placed in any square area. This through-hole barrier is shown crossing this technology roadmap. To cross the barrier (and prevent via starvation), the fabricator must stack vias using blind and buried vias and such.

Make every effort to know the key players in your audience. Those who hold the highest titles may not be the most in uential decision makers. When you know the hierarchy of in uence in your audience, you may be able to gear your persuasive skills toward the key stakeholders. Referring to some key people in the organization can in uence the receptivity of your audience.

Design, Cost, and Performance Trade-Offs The HDI structure is cost-effective for higher-density assemblies shown throughout this chapter. The relative price of HDI versus relative density is depicted in Fig. 22.2. Cost parity (for similar wiring densities) is achieved with a four-layer HDI microvia at approximately an eight-layer, through-hole printed circuit multilayer. Wiring capacities and densities greater than an eightlayer multilayer can be achieved at a lower price with a properly designed HDI substrate.At very high densities, there are no through-hole multilayers that can meet the wiring capacities and density demand necessary, whereas HDI can easily meet the requirements.