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There are a number of different methods to choose from, which will be described in detail in Section 1252 During the initial assessment of the material, it is important to choose at least one of the described test methods to make certain that the material meets the minimum requirements, especially if the material is used in higher-temperature lead-free assembly processes Aside from solder shock testing of bare laminate material, it is also recommended that the PCB engineer consider PCB-level temperature shock as well as repeated reflow testing with a particular focus on resin-reinforcement delaminations This will ensure that not only the raw material but also the completed PCB will be able to withstand the required temperature regime 1244 Glass Transition Temperature (Tg) A further important data point within the initial assessment is the determination of the glass transition temperature (Tg).

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Different test methods are described in more detail in Section 1252 For the first assessment, one method should be selected When choosing the method, it is important to make sure that the test procedure is compatible with the material in test.

Comp. to gold fingers Component to tooling hole Component to mounting hole Hole under component Uncapped via under component No orientation indication Component uncommon orientation Wrong orientation indication No square pad on THMT pin #1 Chip edge protection missing Chip corner protection missing Comp. outside keep-in area Comp. within keep-out area Comp. exceed max height Comp. under min height Component to exposed via Trace under component Comp. to reference designator Comp. without reference designator

Shadowing of inline components Shadowing of staggered components Toeprint to v-cut rout Toeprint to conveyed edge Toeprint to conveyed edge Toeprint to conveyed Edge Toeprint to break tab rout Exposed Via to exposed toeprint Irregular exposed toeprint Via to toeprint masked trace Testpoints/via Clusters Nonuniform SMD pads size

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Nets with one testpoint Nets without testpoints Nets with multiple testpoints Via capped on both sides Uncapped nontestpoint vias Testpoint to conveyed edge Testpoints outside keep-in area Testpoint to silkscreen Testpoints within keep-out area Nets with missing testpoints Nets with necessary testpoints Nets with extra testpoints Net testpoint summary Net testpoint count report

Direct connection to plane No clearance in plane ET pin without PTH MP pin on PTH Edge to edge Missing hole Extra holes Pin too large Pin too small Pin touching No pad for pin Multiple pads for pin Pin center to pad heel Pin center to pad toe min Pin center to pad heel min Pin center to pad toe max Pin diameter vs. hole diameter Large pin right distance max (rect. pins) Large pin toe distance vs. heel distance (rect. pins) (continued)

TABLE 20.6 Checklist of Various Assembly and Test Analyses That Need to Be Performed in Tooling (Continued) A. Fiducial analysis B. Component analysis Misplaced reference designator Wave solder component orientation Component relative orientation C. Padstack analysis D. Testpoint analysis E. Solder paste analysis Large pin left distance vs. right distance (rect. pins) Pin diameter/pad diameter min (%) Pin diameter/pad diameter min (abs) Large pin diameter/ pad diameter min (%) Large pin diameter/pad diameter min (abs) Pin diameter/pad diameter max (%) Pin diameter/pad diameter max (abs) Large pin diameter/pad diameter max (%) Large pin diameter/pad diameter max (abs) Max pin width/pad width min (%) (rect. pins)

(Source: Valor Computerized Systems)

Component analysis SMT components can have a multitude of missing, incorrect, or incomplete characteristics or properties. Component analysis looks for these potential problems, such as one component extending under another component. Table 20.6b provides a typical checklist for such an analysis. Padstack analysis SMT components have critical toeprints (TPs) and need to be checked with respect to vias, planes, solder mask, fabrication edges, and gold fingers. Table 20.6c shows a checklist for a typical analysis. Testpoint analysis SMT components need to be tested by in-circuit test (ICT).These analysis check testpoints to vias, surface features, tooling holes, and electrical nets. See Table 20.6d for a typical checklist for testpoint analysis. Solder paste analysis SMT components have to be soldered correctly. This is the second most important aspect of assembly, just behind placing the right part in the right place. Many checks are necessary to ensure manufacturability, as seen in Table 20.6e.

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